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The Bureau of Industry and Security (BIS) is implementing worldwide export controls on ‘high-entropy alloy or refractory metals and alloys powders for additive manufacturing; electronic assemblies, modules or equipment, containing one or more 'user configurable' Field Programmable Logic Devices (FPLD) having specified parameters; semiconductor deposition equipment for tungsten fill or ruthenium layer meeting specified parameters, and telecommunications network surveillance systems, equipment or components meeting specified parameters for national security and foreign policy reasons. This rule also clarifies an existing note regarding the scope of telecommunications infrastructure equipment. These controls are the product of extensive discussions with international partners.